技術發展路線圖
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項 目 |
2012 |
2013 |
2014 |
2015 |
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|
層 數 |
38L |
40L |
40L |
42L |
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|
線寬/間距 |
內層 |
3/3MIL |
3/3MIL |
3/2.5MIL |
2.5/2.5MIL |
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|
外層 |
3/3MIL |
3/3MIL |
3/2.5MIL |
2.5/2.5MIL |
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|
最小機械鉆孔孔徑 |
6MIL |
6MIL |
4MIL |
4MIL |
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|
板厚孔徑比 |
20:1 |
25:1 |
30:1 |
30:1 |
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|
銅 厚 |
8 oz |
10 oz |
12 oz |
12 oz |
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|
阻抗控制 |
±5% |
±5% |
±5% |
±3% |
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|
材 料 |
高頻、微波材料 |
M |
M |
M |
M |
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|
無鹵素材料 |
M |
M |
M |
M |
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|
無鉛材料 |
M |
M |
M |
M |
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|
混壓 |
M |
M |
M |
M |
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|
金屬基、芯 |
M |
M |
M |
M |
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|
高Tg厚銅繞組 |
M |
M |
M |
M |
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|
HDI |
3＋N＋3 |
S |
P |
M |
M |
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|
4＋N＋4 |
R&D |
S |
P |
M |
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|
激光盲孔電鍍填孔 |
P |
M |
M |
M |
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|
最小激光鉆孔孔徑 |
4MIL |
4MIL |
3MIL |
3MIL |
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|
剛撓結合 |
層數/撓性層數 |
20/10 |
20/10 |
20/10 |
20/10 |
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|
線寬/線距 |
3.5/3.5MIL |
3.5/3.5MIL |
3/3MIL |
3/3MIL |
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|
最小機械孔孔徑 |
8MIL |
6MIL |
6MIL |
4MIL |
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|
鋁基&銅基 |
探深加工能力 |
±0.05MM |
±0.05MM |
±0.03MM |
±0.03MM |
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|
階梯板控深能力 |
±0.1MM |
±0.1MM |
±0.1MM |
±0.1MM |
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|
嵌入式 |
埋入式電容、電阻 |
M |
M |
M |
M |
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|
埋磁芯 |
M |
M |
M |
M |
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|
埋光纖 |
M |
M |
M |
M |
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|
表面處理 |
OSP、沉金、選擇性電金、金手指、沉錫、熱風整平、噴純錫、沉銀 |
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|
SMT組裝 |
PCB 尺寸：50*50mm-510*460mm；板厚：0.2-3mm；SMD元器件封裝：0201；最小節距 ：0.3MM≤PITCH |
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|
PCB設計 |
計算機、光網絡、工控、多媒體、通信類等高速多層高密度PCB布局布線設計;線寬/間距： 75/75; 層數：34L; 高速信號： 12G差分;單板BGA數 ：30; 單板PIN數：40000; |
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備注 |
R&D:研發階段; S:樣品; P:小批量; M:常規生產 |
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